Capital Region Ushers in the Post-Scaling Era with Chip Stacking R&D
Highlights: NY Creates and partners at its Albany NanoTech Complex pioneer 3D heterogeneous integration (3DHI) R&D as the semiconductor industry enters the post-scaling era. IBM Research, GlobalFoundries, GE Aerospace are involved in DARPA projects related to 2.5D/3DHI R&D. Local semiconductor startups get DARPA funding for 2.5D/3DHI-related R&D. Albany-based researchers from













